Photosensitive Interlayer Insulation Film “PV-F”

Superior Formation of Cavities and Thermal Vias

PV-F leverages photolithography to pattern insulation layers, enabling the creation of large cavities that are difficult to achieve with laser drilling, or numerous thermal vias without compromising throughput. PV-F can form cavities 500μm square or larger, which allows superior flexibility of heat dissipation design to that by laser drilling.

What Will You Discover in This Whitepaper?

Resonac's PV-F will provide a solution regarding forming cavities and vias to embedded die substrate makers and power module makers.

Product Features

• Enhanced heat dissipation design flexibility through large cavities
• Formation of small vias and large cavities in a single process
• Low viscosity allows filling at low temperatures and low pressure