Die bonding paste EPINAL

How EPINAL solve the issue?

The increasing use of semiconductors has led to chips of various sizes and thicknesses. Large chips produce more internal stress, requiring specialized sealing resins when using conventional epoxy pastes, while thin chips can warp or detach.

Resonac's die bonding paste, EPINAL <EN-4900GC>, crafted from a mix of epoxy, acrylic resins, and rubber, offers low elastic modulus and high adhesive strength, making it suitable for even larger chips. This product ensures reliable die bonding and reduces costs.

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