
Reducing mold cleaning time by up to 30%*
Regular and efficient mold cleaning in semiconductor manufacturing is crucial to maintaining product quality, preventing resin build-up, and reducing manufacturing losses caused by gas-generated dirt during sealing processes.
Resonac's Mold Cleaning Sheets streamline the cleaning process by integrating it with product molding, requiring fewer shots than melamine resin. Therefore, the sheets can save cleaning time by up to 30%* to boost productivity.
*Compared with melamine resinWhat will you discover in this whitepaper?
Resonac’s <N-CS> series can be applied to both transfer molding and compression molding processes. Download now to delve deeper into the details.
- Cleaning performance of <N-CS>
- How <N-CS> shortens cleaning time*
- Technical Characteristics and Product Overview
Thank you for submitting a form
We sent a confirmation email to you.
If you are having trouble with receiving the email, please reach
out to us.