Epoxy Molding Compound

Balances stress relaxation with delamination prevention

Power semiconductors are crucial in various applications, from home gadgets to electric vehicles. However, their reliability is tested at high operating temperatures. Traditional silicone resin encapsulation often can't handle the expansion and contraction in high Tj* power cycle tests.

Resonac's <CEL-400> series is a heat-resistant epoxy molding compound that enhances stability in high-temperature tests, and reliability in power semiconductors.

Tj*: Junction Temperature

What will you discover in this whitepaper?

Resonac’s <CEL-400> series balances high Tg and decomposition restraint by optimally selecting and compounding epoxy and phenol. Download now to delve deeper into the details.

Product Features

  • Balancing high Tg and decomposition restraint
  • High adhesive strength by adding adhesion promoters
  • Blending low-stress materials to achieve stress relaxation and low elastic modulus

Technical Characteristics

  • Formulation and properties data of <CEL-400> series
  • Ion Trapper (IT) Development
  • Non Sulfur Adhesion Promotor
  • Shrinkage Control Technology

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