Die Bonding Paste EPINAL

High Reliability Die Bonding Paste with Strong Adhesion and Low Modulus

The growing use of semiconductors has led to diverse chip sizes, but larger chips face internal stress, and thinner ones risk warping or detachment. Conventional epoxy pastes lack elasticity, requiring special resins or surface treatments for adhesion.
Resonac's die bonding paste combines epoxy, acrylic resins, and rubber for low elastic modulus, stress reduction, and strong adhesion, ideal for QFN chips and automotive packages.

What will you discover in this whitepaper?

Resonac's “EPINAL” <EN-4900GC> realizes greater reliability and total cost reduction. Download now to delve deeper into the details.

Product Features

  • Lower elastic modulus
  • Greater adhesion

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