Increasing adhesion to sealing materials and reducing internal stress
Increased temperatures in power modules can lead to delamination due to heat-induced stress and weakened adhesion. Traditional methods like roughening lead frame surfaces have limits in preventing delamination with other components. Using a rigid structure to boost heat resistance worsens interfacial adhesion problems.
Resonac's "HIMAL", a heat-resistant coating material used as a sealing material primer, boasting a Tg of 220 degrees Celsius or higher, aims to enhance adhesion, reduce internal stress, and maintain heat resistance, ultimately contributing to higher reliability in power modules.
What will you discover in this whitepaper?
"HIMAL", a heat-resistant coating material employed as a sealing material primer. Download now to delve deeper into the details.
Product Features
- Greater adhesion (Results of shear strength)
- Excellent cycling feature (Reliability test)
- Stress reduction (Simulation)
Technical Characteristics
- Liquid / Film Properties
- Adhesion Evaluation Result
- Power Cycling Test Results (1-in-1 module)
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