Packaging materials for power modules

What does future EV power module packaging require?

Advancements in electric vehicle technology necessitate smaller, high-performance inverters using power semiconductors. As these power modules are the hottest components in EVs, proper thermal management is required.

Effective thermal management, including heat resistance, dissipation, and reliability, is crucial for enhancing inverter performance.

Resonac addresses the following materials, leading to changes in specifications for peripheral materials to enhance heat resistance and dissipation capabilities.

  • High Heat Dissipation Sintered Copper Paste
  • High Tg, Heat-Resistant Epoxy Molding Compounds <CEL-400> Series
  • Heat-resistant Coating Material "HIMAL"
  • Mold Cleaning Sheet N-CS

What will you discover in this whitepaper?

Resonac offers a wide range of high-performance packaging materials that contribute to rapidly advancing xEVs. Download now to delve deeper into the details:

  • The challenges and Resonac's proposals
  • Why Resonac's materials will benefit power modules

Download Whitepaper Now

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