Radio Frequency (RF) Module Substrate MCL-HS200

RF module substrate with low Dk, low Df and low CTE

Wireless communication is evolving from 5G to 5G-Advanced, beyond 5G (6G), in smartphones and other mobile devices. The number of RF communication chips is increasing, along with modularization to handle signals such as Bluetooth, WiFi and NFC. RF module substrates require low dielectric properties and low CTE.

Resonac recommends its RF module substrate MCL-HS200 (Type D) necessitate low dielectric properties (low Dk and low Df) along with low transmission loss at high frequencies and low coefficients of thermal expansion (CTE) to ensure reliability.

What will you discover in this whitepaper?

Resonac's RF module substrate MCL-HS200 (Type D) with these product features, meets the requirements for modularization. We kindly invite you to download now for a more in-depth exploration of the details.

Product Features

• Low transmission loss
• Low warpage
• High reliability