High Filler Loading without Viscosity Increase
Boron nitride possesses thermal conductivity and insulation properties, making it suitable for applications such as thermal interface materials and printed circuit board materials. However, the viscosity increase associated with high filler loading has been a barrier to practical use.
Resonac's ST-BN utilizes a proprietary chemical surface treatment to suppress the viscosity increase at high filler loadings, enabling a balance between processability and thermal conductivity.
What will you discover in this whitepaper?
This whitepaper provides a comprehensive overview of the technical properties of ST-BN, along with detailed performance data such as the dielectric breakdown voltage of resin compounds.
Product Features
- Enhanced thermal conductivity through high filler loading
- Improved processability by suppressing resin varnish viscosity increase
- Superior adhesion strength to copper foil
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