Technology Trends of Cutting-Edge Next-Generation Semiconductor Packages, Materials, and Substrates

IoT, 5G, ADAS, and generative AI, and other technologies have led to an increase in information, which necessitates high-speed, high-capacity, and wide-bandwidth transmission in data centers and terminals. This requirement calls for the miniaturization, high integration, high density, and narrow pitch of chip connection parts, as well as the need for large-area coverage for 2.xD to 3D packages on the package substrate.

This technical document introduces the latest trends in core materials that support next-generation semiconductor packages and substrates, along with presenting solutions that meet the technical requirements arising from these trends.

Table of Contents

1. Introduction
2. Market and technology trends of semiconductor packages
3. Challenges and development trends of next-generation package substrate core materials
4. Technical Characteristics

Technical Characteristics

• Lineup of low CTE, high elastic modulus core materials
• Warpage simulation with different substrate materials and thickness
• Processability as core materials
• TYPE-F – flattening technology
• Thickness accuracy, dimensional change and coplanarity of TYPE-F